It is important that staff who are involved in rework of PCBs know how to replace surface mount components successfully – getting it right first time, every time; and this course provides students with the practical skills needed for the reworking of such surface-mounted devices.
The course, which follows on from The Electronics Group’s Introduction to hand soldering of surface mount devices course, explores the use of a range of soldering processes including hot air, infra-red and solder paste and, when hand soldering, soldering iron use and using different gauges of solder wire, enabling staff to achieve the correct volume of solder for the type of connection.
Using a number of techniques, boards are prepared and soldered with lead-free solder and solder paste as well as leaded. A variety of solder compositions are used to ensure students have first-hand knowledge of the qualities and attributes of different solders.
The components used on this course range from chips to SOTs, SOICs, MELFs and gull wing quad flat packs, including J-lead packages. We discuss and demonstrate techniques for the safe removal of mis-aligned components, board clean-up or preparation and then the onsertion of the new device. These techniques are also suitable for prototype circuit building.
Emphasis is placed on the diagnosis of visual faults that occur when reworking this range of components; these include dry joints, icicles, blow holes, insufficient as well as excessive solder, de-wetting, non-wetting, tombstoning and misplacement. ESD implications are also discussed with respect to handling, storage and packaging.
Whilst visual inspection of a soldered joint is normally carried out between 4x and 10x magnification, some faults are examined at a greater magnification to enable to student to fully appreciate the issues involved in the defect. X-ray images are therefore also used to show how voiding can affect the quality of a connection.
Subjects covered and Student assessments
Subjects covered include:
• Workshop practices
• Soldering and removal of CHIP, SOT, SOIC, QFP, and J-lead components
• Identification of typical faults by reference to quality standards
Assessments at the end of the areas covered will result in The Electronics Group’s certificate of success being awarded to candidates who achieve the required standard. Within this programme students will also be able to take an IPC course of study and receive the IPC Lead Free Surface Mount Rework DVD-67C Certificate on successful completion of that course. (Other related IPC short courses of study may also be added*)
Who should attend?
Those with practical experience of soldering surface mount devices (SMDs) but who need to enhance their skills and understanding, or move on to working with more complex components, will benefit from this course.
Previous attendance at The Electronics Group’s Introduction to hand soldering of surface mount devices course is advisable but not essential for those with existing experience.
What is included?
All course materials are included together with a light lunch and all refreshments during the day.
Cancellation and postponement details can be found in our Terms and Conditions.